Issued Patents 2018
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163567 | Multi-layered aluminum oxide capacitor | Bum Mo AHN | 2018-12-25 |
| 10147401 | Display device and method for displaying an image thereon | Kang Hee Lee, Chai Hoon Lim, Mi-Young Joo | 2018-12-04 |
| 10128414 | Chip substrate provided with joining grooves in lens insert | Tae Hwan Song | 2018-11-13 |
| 10127857 | Temperature estimating apparatus, a method of estimating a temperature, and a display system including the temperature estimating apparatus | Jin Ho Lee, So Young Kim, Woo-Seok Jang, Man-Bok Cheon | 2018-11-13 |
| 10062812 | Substrate for can package-type optical device and optical device using same | Ki Myung Nam, Tae Hwan Song | 2018-08-28 |
| 10039160 | Light engine for light emitting element | Bum Mo AHN, Tae Hwan Song | 2018-07-31 |
| 10019939 | Organic light emitting display device and driving method thereof | Jae-Hoon Lee, Do-Hyung Ryu, Jae-Woo Song, Hae-Goo Jung | 2018-07-10 |
| 10015841 | Micro heater and micro sensor and manufacturing methods thereof | Bum Mo AHN, Sung Hyun BYUN | 2018-07-03 |
| 10014446 | Chip substrate | Bum Mo AHN, Tae Hwan Song | 2018-07-03 |
| 10014455 | Chip substrate comprising cavity with curved surfaces | Tae Hwan Song, Sung Hyun BYUN | 2018-07-03 |
| 10008638 | Method for manufacturing optical element for backlight unit and optical element and optical element array manufactured by method | Bum Mo AHN, Ki Myung Nam | 2018-06-26 |
| 9960169 | Methods of manufacturing semiconductor devices | Jun Seok Lee, Byoung-ho Kwon, Sang Kyun Kim, Yun-Jeong Kim, Hao Cui +1 more | 2018-05-01 |
| 9913381 | Base substrate which prevents burrs generated during the cutting process and method for manufacturing the same | Bum Mo AHN, Kyoung Ja Yun | 2018-03-06 |
| 9887096 | Differential silicon oxide etch | Yunyu Wang, Jingchun Zhang, Anchuan Wang, Nitin K. Ingle | 2018-02-06 |
| 9865787 | Chip substrate and chip package module | Bum Mo AHN | 2018-01-09 |