Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128414 | Chip substrate provided with joining grooves in lens insert | Seung Ho Park | 2018-11-13 |
| 10062812 | Substrate for can package-type optical device and optical device using same | Ki Myung Nam, Seung Ho Park | 2018-08-28 |
| 10039160 | Light engine for light emitting element | Bum Mo AHN, Seung Ho Park | 2018-07-31 |
| 10014446 | Chip substrate | Bum Mo AHN, Seung Ho Park | 2018-07-03 |
| 10014455 | Chip substrate comprising cavity with curved surfaces | Seung Ho Park, Sung Hyun BYUN | 2018-07-03 |