Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163777 | Interconnects for semiconductor packages | Eng Huat Goh, Hoay Tien Teoh, Jenny Shio Yin Ong, Jia Yan Go, Jiun Hann Sir +1 more | 2018-12-25 |
| 9972589 | Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layer | Eng Huat Goh, Min Suet Lim, Jiun Hann Sir, Hoay Tien Teoh | 2018-05-15 |