| 10094034 |
Edge flow element for electroplating apparatus |
Gabriel Hay Graham, Bryan L. Buckalew, Steven T. Mayer, James Isaac Fortner, Lee Peng Chua |
2018-10-09 |
| 10092933 |
Methods and apparatuses for cleaning electroplating substrate holders |
Santosh Kumar, Bryan L. Buckalew, Steven T. Mayer, Thomas A. Ponnuswamy, Chad Michael Hosack +2 more |
2018-10-09 |
| 10087545 |
Automated cleaning of wafer plating assembly |
Steven T. Mayer, Thomas A. Ponnuswamy, Lee Peng Chua |
2018-10-02 |
| 10066311 |
Multi-contact lipseals and associated electroplating methods |
John Floyd Ostrowski |
2018-09-04 |
| 10053793 |
Integrated elastomeric lipseal and cup bottom for reducing wafer sticking |
Aaron Berke, Steven T. Mayer, Santosh Kumar, Lee Peng Chua |
2018-08-21 |
| 10017869 |
Electroplating apparatus for tailored uniformity profile |
Steven T. Mayer, David W. Porter, Bryan L. Buckalew |
2018-07-10 |
| 10014170 |
Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity |
Burhanuddin Kagajwala, Bryan L. Buckalew, Lee Peng Chua, Aaron Berke, Steven T. Mayer |
2018-07-03 |
| 9988733 |
Apparatus and method for modulating azimuthal uniformity in electroplating |
Gabriel Hay Graham, Lee Peng Chua, Steven T. Mayer, Aaron Berke |
2018-06-05 |
