Issued Patents 2018
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128102 | Methods and apparatus for wetting pretreatment for through resist metal plating | Lee Peng Chua, Bryan L. Buckalew, Thomas A. Ponnuswamy, Brian Paul Blackman, Chad Michael Hosack | 2018-11-13 |
| 10106907 | Protecting anodes from passivation in alloy plating systems | Lee Peng Chua, David W. Porter, Thomas A. Ponnuswamy | 2018-10-23 |
| 10094038 | Monitoring electrolytes during electroplating | Matthew Thorum | 2018-10-09 |
| 10094034 | Edge flow element for electroplating apparatus | Gabriel Hay Graham, Bryan L. Buckalew, Robert Rash, James Isaac Fortner, Lee Peng Chua | 2018-10-09 |
| 10092933 | Methods and apparatuses for cleaning electroplating substrate holders | Santosh Kumar, Bryan L. Buckalew, Thomas A. Ponnuswamy, Chad Michael Hosack, Robert Rash +2 more | 2018-10-09 |
| 10087545 | Automated cleaning of wafer plating assembly | Thomas A. Ponnuswamy, Lee Peng Chua, Robert Rash | 2018-10-02 |
| 10053793 | Integrated elastomeric lipseal and cup bottom for reducing wafer sticking | Aaron Berke, Robert Rash, Santosh Kumar, Lee Peng Chua | 2018-08-21 |
| 10017869 | Electroplating apparatus for tailored uniformity profile | David W. Porter, Bryan L. Buckalew, Robert Rash | 2018-07-10 |
| 10014170 | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity | Burhanuddin Kagajwala, Bryan L. Buckalew, Lee Peng Chua, Aaron Berke, Robert Rash | 2018-07-03 |
| 10011919 | Electrolyte delivery and generation equipment | Gregory J. Kearns, Richard Abraham, Lawrence Ossowski | 2018-07-03 |
| 9988733 | Apparatus and method for modulating azimuthal uniformity in electroplating | Gabriel Hay Graham, Lee Peng Chua, Robert Rash, Aaron Berke | 2018-06-05 |
| 9982357 | Electroplating apparatus and process for wafer level packaging | David W. Porter | 2018-05-29 |
| 9899230 | Apparatus for advanced packaging applications | Bryan L. Buckalew, David W. Porter, Thomas A. Ponnuswamy | 2018-02-20 |
| 9856574 | Monitoring leveler concentrations in electroplating solutions | — | 2018-01-02 |