Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10053793 | Integrated elastomeric lipseal and cup bottom for reducing wafer sticking | Robert Rash, Steven T. Mayer, Santosh Kumar, Lee Peng Chua | 2018-08-21 |
| 10014170 | Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity | Burhanuddin Kagajwala, Bryan L. Buckalew, Lee Peng Chua, Robert Rash, Steven T. Mayer | 2018-07-03 |
| 9988733 | Apparatus and method for modulating azimuthal uniformity in electroplating | Gabriel Hay Graham, Lee Peng Chua, Steven T. Mayer, Robert Rash | 2018-06-05 |