Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147694 | Direct injection molded solder process for forming solder bumps on wafers | Bing Dang, Paul A. Lauro, Jae-Woong Nah | 2018-12-04 |
| 10141236 | Flip chip ball grid array with low impedence and grounded lid | Martin Beaumier, Yves Dallaire, Melania C. Doll, Edward J. Yarmchuk | 2018-11-27 |
| 10043725 | Flip chip ball grid array with low impedence and grounded lid | Martin Beaumier, Yves Dallaire, Melania C. Doll, Edward J. Yarmchuk | 2018-08-07 |