YD

Yves Dallaire

IBM: 2 patents #3,188 of 10,623Top 35%
📍 Tai Po, CN: #3 of 9 inventorsTop 35%
Overall (2018): #85,330 of 503,207Top 20%
2
Patents 2018

Issued Patents 2018

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10141236 Flip chip ball grid array with low impedence and grounded lid Martin Beaumier, Melania C. Doll, Michael A. Gaynes, Edward J. Yarmchuk 2018-11-27
10043725 Flip chip ball grid array with low impedence and grounded lid Martin Beaumier, Melania C. Doll, Michael A. Gaynes, Edward J. Yarmchuk 2018-08-07