Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157823 | High density fan out package structure | Dong Wook Kim, Hong Bok We, Shiqun Gu | 2018-12-18 |
| 10049977 | Semiconductor package on package structure and method of forming the same | Hong Bok We, Dong Wook Kim, Kyu-Pyung Hwang, Young Kyu Song | 2018-08-14 |
| 9881859 | Substrate block for PoP package | Hong Bok We, Dong Wook Kim, Shiqun Gu, Ratibor Radojcic | 2018-01-30 |