Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10079097 | Capacitor structure for power delivery applications | Young Kyu Song, Hong Bok We | 2018-09-18 |
| 10049977 | Semiconductor package on package structure and method of forming the same | Hong Bok We, Dong Wook Kim, Jae Sik Lee, Young Kyu Song | 2018-08-14 |
| 9933455 | Known good die testing for high frequency applications | Young Kyu Song | 2018-04-03 |
| 9875997 | Low profile reinforced package-on-package semiconductor device | Hong Bok We, Dong Wook Kim, Young Kyu Song | 2018-01-23 |