Issued Patents 2018
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109584 | Patterned grounds and methods of forming the same | Uei-Ming Jow, Jung Ho Yoon, Jong-Hoon Lee, Xiaonan Zhang | 2018-10-23 |
| 10079097 | Capacitor structure for power delivery applications | Hong Bok We, Kyu-Pyung Hwang | 2018-09-18 |
| 10049977 | Semiconductor package on package structure and method of forming the same | Hong Bok We, Dong Wook Kim, Jae Sik Lee, Kyu-Pyung Hwang | 2018-08-14 |
| 10051741 | Embedded layered inductor | Daeik Daniel Kim, Xiaonan Zhang, Ryan David Lane, Jonghae Kim | 2018-08-14 |
| 9933455 | Known good die testing for high frequency applications | Kyu-Pyung Hwang | 2018-04-03 |
| 9875997 | Low profile reinforced package-on-package semiconductor device | Hong Bok We, Dong Wook Kim, Kyu-Pyung Hwang | 2018-01-23 |