Issued Patents 2018
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163834 | Chip package structure comprising encapsulant having concave surface | Li-Chih Fang, Nan-Chun Lin, Shang-Yu Chang Chien | 2018-12-25 |
| 10157828 | Chip package structure with conductive pillar and a manufacturing method thereof | Nan-Chun Lin | 2018-12-18 |
| 10141276 | Semiconductor package structure and manufacturing method thereof | Nan-Chun Lin, Shang-Yu Chang Chien | 2018-11-27 |
| 10079218 | Test method for a redistribution layer | Han-Wen Lin, Shang-Yu Chang-Chien, Nan-Chun Lin | 2018-09-18 |
| 10002848 | Test method for a redistribution layer | Han-Wen Lin, Shang-Yu Chang-Chien, Nan-Chun Lin | 2018-06-19 |
| 9991206 | Package method including forming electrical paths through a mold layer | LIEN CHIA CHANG, Chih-Ming Ko | 2018-06-05 |
| 9972554 | Wafer level chip scale package having continuous through hole via configuration and fabrication method thereof | Li-Chih Fang, Chia-Chang Chang, Wen-Hsiung Chang, KEE-WEI CHUNG, Chia-Wen Lien | 2018-05-15 |