Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163834 | Chip package structure comprising encapsulant having concave surface | Li-Chih Fang, Hung-Hsin Hsu, Nan-Chun Lin | 2018-12-25 |
| 10141276 | Semiconductor package structure and manufacturing method thereof | Hung-Hsin Hsu, Nan-Chun Lin | 2018-11-27 |