Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9991206 | Package method including forming electrical paths through a mold layer | LIEN CHIA CHANG, Hung-Hsin Hsu | 2018-06-05 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9991206 | Package method including forming electrical paths through a mold layer | LIEN CHIA CHANG, Hung-Hsin Hsu | 2018-06-05 |