Issued Patents 2018
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9972554 | Wafer level chip scale package having continuous through hole via configuration and fabrication method thereof | Li-Chih Fang, Hung-Hsin Hsu, Wen-Hsiung Chang, KEE-WEI CHUNG, Chia-Wen Lien | 2018-05-15 |