Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10124405 | Manufacturing method for metallic housing of electronic device | CAI-HUA WANG, YUE-JIAN LI, Chen-Shen Lin, Chun-Jung Chang | 2018-11-13 |
| 10040120 | Manufacturing method for metallic housing of electronic device | CAI-HUA WANG, YUE-JIAN LI, Chen-Shen Lin, Chun-Jung Chang | 2018-08-07 |
| 9972554 | Wafer level chip scale package having continuous through hole via configuration and fabrication method thereof | Li-Chih Fang, Chia-Chang Chang, Hung-Hsin Hsu, KEE-WEI CHUNG, Chia-Wen Lien | 2018-05-15 |
| 9901979 | Metallic article and method for manufacturing metallic article | Jun Yang, CAI-HUA WANG, YUE-JIAN LI, Chen-Shen Lin, Chun-Jung Chang | 2018-02-27 |