Issued Patents 2018
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10157823 | High density fan out package structure | Dong Wook Kim, Jae Sik Lee, Shiqun Gu | 2018-12-18 |
| 10079097 | Capacitor structure for power delivery applications | Young Kyu Song, Kyu-Pyung Hwang | 2018-09-18 |
| 10049977 | Semiconductor package on package structure and method of forming the same | Dong Wook Kim, Jae Sik Lee, Kyu-Pyung Hwang, Young Kyu Song | 2018-08-14 |
| 9881859 | Substrate block for PoP package | Dong Wook Kim, Jae Sik Lee, Shiqun Gu, Ratibor Radojcic | 2018-01-30 |
| 9875997 | Low profile reinforced package-on-package semiconductor device | Dong Wook Kim, Kyu-Pyung Hwang, Young Kyu Song | 2018-01-23 |