Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9991197 | Fabrication method of semiconductor package | Chia-Cheng Chen, Shao-Tzu Tang, Yu Liu, Ying-Chou Tsai | 2018-06-05 |
| 9899235 | Fabrication method of packaging substrate | Ying-Chou Tsai, Sheng-Che Huang | 2018-02-20 |