Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10103056 | Methods for wet metal seed deposition for bottom up gapfill of features | Samantha Tan, Boris Volosskiy, Taeseung Kim, Praveen Nalla, Novy Tjokro | 2018-10-16 |
| 10079207 | Metallization of the wafer edge for optimized electroplating performance on resistive substrates | — | 2018-09-18 |
| 10049921 | Method for selectively sealing ultra low-k porous dielectric layer using flowable dielectric film formed from vapor phase dielectric precursor | Nerissa Draeger, Kaihan Ashtiani, Deenesh Padhi, Derek Wong, Bart J. van Schravendijk +3 more | 2018-08-14 |
| 9875968 | Interlevel conductor pre-fill utilizing selective barrier deposition | William T. Lee, Larry Zhao, Derek Wong, Praveen Nalla, Kaihan Ashtiani +2 more | 2018-01-23 |