Jasmeet S. Chawla — 3 Patents at Intel

Issued Patents 2018

Showing 1–3 of 3 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
10109583	Method for creating alternate hardmask cap interconnect structure with increased overlay margin	Robert L. Bristol, Manish Chandhok, Florian Gstrein, Eungnak Han, Rami Hourani +3 more	2018-10-23	$21,867,000
10032643	Method and structure to contact tight pitch conductive layers with guided vias using alternating hardmasks and encapsulating etchstop liner scheme	Ruth A. Brain, Richard E. Schenker, Kanwal Jit Singh, Alan M. Myers	2018-07-24	$23,531,000
9911694	Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches	Christopher J. Jezewski	2018-03-06	$18,859,000