Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109583 | Method for creating alternate hardmask cap interconnect structure with increased overlay margin | Robert L. Bristol, Manish Chandhok, Florian Gstrein, Eungnak Han, Rami Hourani +3 more | 2018-10-23 |
| 10032643 | Method and structure to contact tight pitch conductive layers with guided vias using alternating hardmasks and encapsulating etchstop liner scheme | Ruth A. Brain, Richard E. Schenker, Kanwal Jit Singh, Alan M. Myers | 2018-07-24 |
| 9911694 | Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches | Christopher J. Jezewski | 2018-03-06 |