Issued Patents 2018
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10109583 | Method for creating alternate hardmask cap interconnect structure with increased overlay margin | Robert L. Bristol, Manish Chandhok, Jasmeet S. Chawla, Florian Gstrein, Eungnak Han +3 more | 2018-10-23 |
| 10032643 | Method and structure to contact tight pitch conductive layers with guided vias using alternating hardmasks and encapsulating etchstop liner scheme | Jasmeet S. Chawla, Ruth A. Brain, Kanwal Jit Singh, Alan M. Myers | 2018-07-24 |