LJ

Lei Jing

Applied Materials: 1 patents #421 of 1,019Top 45%
Futurewei Technologies: 1 patents #201 of 468Top 45%
Overall (2018): #126,549 of 503,207Top 30%
2
Patents 2018

Issued Patents 2018

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10100408 Edge hump reduction faceplate by plasma modulation Sungwon Ha, Kwangduk Douglas Lee, Ganesh Balasubramanian, Juan Carlos Rocha-Alvarez, Martin Jay Seamons +5 more 2018-10-16
10079584 Closed-loop automatic gain control in linear burst-mode transimpedance amplifier Peter Ossieur, Ning Cheng, Naresh Chand 2018-09-18