Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10121868 | Methods of forming epi semiconductor material on a thinned fin in the source/drain regions of a FinFET device | Yi Qi, Jianwei Peng, Hsien-Ching Lo, Kwan-Yong Lim | 2018-11-06 |
| 10090382 | Integrated circuit structure including single diffusion break and end isolation region, and methods of forming same | Hong Yu, Xinyuan Dou, Zhenyu Hu | 2018-10-02 |
| 9887094 | Methods of forming EPI semiconductor material on the source/drain regions of a FinFET device | Yi Qi, Hsien-Ching Lo, Jianwei Peng, Yanping Shen | 2018-02-06 |