Issued Patents 2018
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10023956 | Eliminating first wafer metal contamination effect in high density plasma chemical vapor deposition systems | Jason D. Park | 2018-07-17 |
| 10020183 | Edge roughness reduction | Yansha Jin, Zhongkui Tan, Qian Fu, Martin Shim | 2018-07-10 |
| 9991128 | Atomic layer etching in continuous plasma | Zhongkui Tan, Yiting Zhang, Ying Wu, Qing Xu, Qian Fu +1 more | 2018-06-05 |