Issued Patents 2018
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10163696 | Selective cobalt removal for bottom up gapfill | Xikun Wang, Jianxin Lei, Nitin K. Ingle | 2018-12-25 |
| 10081881 | Electroplating apparatus with membrane tube shield | Paul R. McHugh, Gregory J. Wilson | 2018-09-25 |
| 10062607 | Methods for producing interconnects in semiconductor devices | Ismail Emesh, Mehul Naik | 2018-08-28 |
| 10000860 | Methods of electrochemical deposition for void-free gap fill | Serdar Aksu, Jung Gu Lee, Bart Sakry | 2018-06-19 |