Issued Patents 2018
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10139913 | Rotational input device | Shun-Pin Lin | 2018-11-27 |
| 10128198 | Double side via last method for double embedded patterned substrate | You-Lung Yen, Yuan-Chang Su | 2018-11-13 |
| 10096542 | Substrate, semiconductor package structure and manufacturing process | Yuan-Chang Su | 2018-10-09 |
| 10083902 | Semiconductor package structure and semiconductor process | Yuan-Chang Su, Cheng-Lin Ho | 2018-09-25 |
| 10079156 | Semiconductor package including dielectric layers defining via holes extending to component pads | Yuan-Chang Su, Yu-Lin Shih, You-Lung Yen | 2018-09-18 |
| 10074602 | Substrate, semiconductor package structure and manufacturing process | — | 2018-09-11 |
| 10017635 | Thermoplastic resin composition and product formed therefrom | — | 2018-07-10 |
| 9997442 | Semiconductor device and method of manufacturing the same | Chai-Chi Lin, Hsing Kuo Tien, Chih-Yung Yang | 2018-06-12 |
| 9984898 | Substrate, semiconductor package including the same, and method for manufacturing the same | Li-Chuan Tsai, Cheng-Lin Ho | 2018-05-29 |
| 9966333 | Semiconductor substrate, semiconductor module and method for manufacturing the same | Li-Chuan Tsai | 2018-05-08 |
| 9917071 | Semiconductor packages | Ying-Ta Chiu, Yong-Da Chiu, Dao-Long Chen, Chih-Pin Hung | 2018-03-13 |
| 9887167 | Embedded component package structure and method of manufacturing the same | Hsing Kuo Tien, Li-Chuan Tsai | 2018-02-06 |