Issued Patents 2018
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10083902 | Semiconductor package structure and semiconductor process | Yuan-Chang Su, Chih-Cheng Lee | 2018-09-25 |
| 9984898 | Substrate, semiconductor package including the same, and method for manufacturing the same | Li-Chuan Tsai, Chih-Cheng Lee | 2018-05-29 |