Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799694 | Backside through vias in a bonded structure | Ku-Feng Yang, Hung-Pin Chang, Wen-Chih Chiou, Chen-Hua Yu | 2017-10-24 |
| 9793192 | Formation of through via before contact processing | Chen-Hua Yu, Wen-Chih Chiou | 2017-10-17 |
| 9728457 | System, structure, and method of manufacturing a semiconductor substrate stack | Hung-Pin Chang, Wen-Chih Chiou, Chen-Hua Yu | 2017-08-08 |