Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799694 | Backside through vias in a bonded structure | Weng-Jin Wu, Ku-Feng Yang, Wen-Chih Chiou, Chen-Hua Yu | 2017-10-24 |
| 9728457 | System, structure, and method of manufacturing a semiconductor substrate stack | Weng-Jin Wu, Wen-Chih Chiou, Chen-Hua Yu | 2017-08-08 |
| 9601410 | Semiconductor device and method | Cheng-Chun Tsai, Ku-Feng Yang, Yi-Hsiu Chen, Wen-Chih Chiou | 2017-03-21 |