Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9799581 | Integrated fan-out structure with openings in buffer layer | Wu Sen Chiu, Po-Hao Tsai, Jing-Cheng Lin | 2017-10-24 |
| 9761566 | Multi-die structure and method of forming same | Chen-Hua Yu, Po-Hao Tsai, Jing-Cheng Lin | 2017-09-12 |
| 9646918 | Semiconductor device and method | Po-Hao Tsai, Jing-Cheng Lin | 2017-05-09 |
| 9633895 | Integrated fan-out structure with guiding trenches in buffer layer | Po-Hao Tsai, Feng-Cheng Hsu, Jui-Pin Hung, Jing-Cheng Lin | 2017-04-25 |
| 9633934 | Semicondutor device and method of manufacture | Jing-Cheng Lin, Po-Hao Tsai, Porter Chen | 2017-04-25 |
| 9583420 | Semiconductor device and method of manufactures | Jing-Cheng Lin, Po-Hao Tsai | 2017-02-28 |