FH

Feng-Cheng Hsu

TSMC: 2 patents #920 of 2,832Top 35%
📍 New Taipei, TW: #334 of 2,136 inventorsTop 20%
Overall (2017): #154,095 of 506,227Top 35%
2
Patents 2017

Issued Patents 2017

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
9633895 Integrated fan-out structure with guiding trenches in buffer layer Po-Hao Tsai, Li-Hui Cheng, Jui-Pin Hung, Jing-Cheng Lin 2017-04-25
9627346 Underfill pattern with gap Hou-Ju Huang, Szu-Wei Lu, Jing-Cheng Lin 2017-04-18