Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748531 | Cap assembly for battery | Sheng-Fa Yeh, Chiou-Chu Lai, Deng-Tswen Shieh, Chich-Lun Lo, Shu-Ping Lin +2 more | 2017-08-29 |
| 9741689 | 3-D package having plurality of substrates | Jing-Cheng Lin, Chen-Hua Yu | 2017-08-22 |
| 9679783 | Molding wafer chamber | Jing-Cheng Lin, Jui-Pin Hung, Szu-Wei Lu, Shin-Puu Jeng, Chen-Hua Yu | 2017-06-13 |