Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9802251 | Ni ball, Ni core ball, solder joint, solder paste, and solder foam | Hiroyoshi Kawasaki, Takashi Akagawa, Yuichi Koikeda, Atsushi Ikeda, Masaru Sasaki +2 more | 2017-10-31 |
| 9668358 | Cu ball | Hiroyoshi Kawasaki, Takahiro Hattori, Daisuke Soma, Isamu Sato | 2017-05-30 |