Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9802251 | Ni ball, Ni core ball, solder joint, solder paste, and solder foam | Hiroyoshi Kawasaki, Takashi Akagawa, Yuichi Koikeda, Atsushi Ikeda, Masaru Sasaki +2 more | 2017-10-31 |
| 9662730 | Bump electrode, board which has bump electrodes, and method for manufacturing the board | Takahiro Hattori, Isamu Sato | 2017-05-30 |
| 9668358 | Cu ball | Hiroyoshi Kawasaki, Takahiro Hattori, Takahiro Roppongi, Isamu Sato | 2017-05-30 |