Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9802251 | Ni ball, Ni core ball, solder joint, solder paste, and solder foam | Hiroyoshi Kawasaki, Takashi Akagawa, Atsushi Ikeda, Masaru Sasaki, Takahiro Roppongi +2 more | 2017-10-31 |