Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9816160 | Ni ball, Ni nuclear ball, solder joint, foam solder and solder paste | Ryoichi Kurata, Takashi Akagawa | 2017-11-14 |
| 9802251 | Ni ball, Ni core ball, solder joint, solder paste, and solder foam | Takashi Akagawa, Yuichi Koikeda, Atsushi Ikeda, Masaru Sasaki, Takahiro Roppongi +2 more | 2017-10-31 |
| 9668358 | Cu ball | Takahiro Hattori, Takahiro Roppongi, Daisuke Soma, Isamu Sato | 2017-05-30 |