Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9662730 | Bump electrode, board which has bump electrodes, and method for manufacturing the board | Daisuke Soma, Isamu Sato | 2017-05-30 |
| 9668358 | Cu ball | Hiroyoshi Kawasaki, Takahiro Roppongi, Daisuke Soma, Isamu Sato | 2017-05-30 |