Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852972 | Semiconductor device and method of aligning semiconductor wafers for bonding | Francis J. Carney | 2017-12-26 |
| 9847219 | Semiconductor die singulation method | William F. Burghout, Dennis Lee Conner, Jay A. Yoder, Gordon M. Grivna | 2017-12-19 |
| 9847310 | Flip chip bonding alloys | Francis J. Carney | 2017-12-19 |
| 9793186 | Semiconductor wafer and method of backside probe testing through opening in film frame | Heng Chen Lee | 2017-10-17 |
| 9711434 | Stacked semiconductor device structure and method | Francis J. Carney | 2017-07-18 |
| 9564409 | Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel | Francis J. Carney | 2017-02-07 |