Issued Patents 2017
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847219 | Semiconductor die singulation method | William F. Burghout, Dennis Lee Conner, Michael J. Seddon, Jay A. Yoder | 2017-12-19 |
| 9818837 | Process of forming an electronic device having an electronic component | — | 2017-11-14 |
| 9818831 | DMOS transistor including a gate dielectric having a non-uniform thickness | Gary H. Loechelt | 2017-11-14 |
| 9812354 | Process of forming an electronic device including a material defining a void | Michael Thomason, Stevan G. Hunter | 2017-11-07 |
| 9780196 | Method of forming a semiconductor device including forming a shield conductor overlying a gate conductor | Balaji Padmanabhan, Prasad Venkatraman | 2017-10-03 |
| 9773689 | Semiconductor die singulation method using varied carrier substrate temperature | — | 2017-09-26 |
| 9773693 | Method of forming a semiconductor device including trench termination | Zia Hossain, Ali Salih | 2017-09-26 |
| 9755032 | Method of forming a semiconductor device and structure therefor | — | 2017-09-05 |
| 9711406 | Method and apparatus for plasma dicing a semi-conductor wafer | Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman | 2017-07-18 |
| 9711556 | Semiconductor image sensor structure having metal-filled trench contact | Rick C. Jerome, David T. Price, Sungkwon Hong | 2017-07-18 |
| 9620585 | Termination for a stacked-gate super-junction MOSFET | Gary H. Loechelt | 2017-04-11 |
| 9620639 | Electronic device including a trench and a conductive structure therein | Zia Hossain | 2017-04-11 |
| RE46339 | Method and apparatus for plasma dicing a semi-conductor wafer | Rich Gauldin, Chris Johnson, David Johnson, Linnell Martinez, David Pays-Volard +1 more | 2017-03-14 |
| 9589844 | Electronic die singulation method | — | 2017-03-07 |
| 9570494 | Method for forming a semiconductor image sensor device | Rick C. Jerome, David T. Price, Sungkwon Hong | 2017-02-14 |
| 9564365 | Method of singulating semiconductor wafer having back layer | — | 2017-02-07 |
| 9564366 | Method and apparatus for plasma dicing a semi-conductor wafer | Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman | 2017-02-07 |
| 9552993 | Semiconductor device and manufacturing method thereof | Michael Thomason, Mohammed Tanvir Quddus, James Morgan, Mihir Mudholkar, Scott Donaldson | 2017-01-24 |
| 9553165 | Method of forming a semiconductor device | Ali Salih | 2017-01-24 |