Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711556 | Semiconductor image sensor structure having metal-filled trench contact | David T. Price, Sungkwon Hong, Gordon M. Grivna | 2017-07-18 |
| 9570494 | Method for forming a semiconductor image sensor device | David T. Price, Sungkwon Hong, Gordon M. Grivna | 2017-02-14 |