Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847219 | Semiconductor die singulation method | William F. Burghout, Michael J. Seddon, Jay A. Yoder, Gordon M. Grivna | 2017-12-19 |
| 9558968 | Single or multi chip module package and related methods | Stephen St. Germain, Roger M. Arbuthnot, Jay A. Yoder | 2017-01-31 |