Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9847219 | Semiconductor die singulation method | William F. Burghout, Dennis Lee Conner, Michael J. Seddon, Gordon M. Grivna | 2017-12-19 | $6,131,000 |
| 9558968 | Single or multi chip module package and related methods | Stephen St. Germain, Roger M. Arbuthnot, Dennis Lee Conner | 2017-01-31 | $13,205,000 |