Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852972 | Semiconductor device and method of aligning semiconductor wafers for bonding | Michael J. Seddon | 2017-12-26 |
| 9847270 | Method for insulating singulated electronic die | — | 2017-12-19 |
| 9847310 | Flip chip bonding alloys | Michael J. Seddon | 2017-12-19 |
| 9748163 | Die support for enlarging die size | Soon Wei WANG, How Kiat Liew, Chee Hiong CHEW | 2017-08-29 |
| 9711434 | Stacked semiconductor device structure and method | Michael J. Seddon | 2017-07-18 |
| 9691732 | Semiconductor package with elastic coupler and related methods | Yusheng LIN, Chee Hiong CHEW | 2017-06-27 |
| 9679878 | Embedded stacked die packages and related methods | Yusheng LIN, Yenting Wen, Chee Hiong CHEW, Azhar Aripin | 2017-06-13 |
| 9564409 | Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel | Michael J. Seddon | 2017-02-07 |