Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691732 | Semiconductor package with elastic coupler and related methods | Chee Hiong CHEW, Francis J. Carney | 2017-06-27 |
| 9679878 | Embedded stacked die packages and related methods | Francis J. Carney, Yenting Wen, Chee Hiong CHEW, Azhar Aripin | 2017-06-13 |
| 9640497 | Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methods | Takashi Noma, Shinzo Ishibe | 2017-05-02 |
| 9570832 | Press-fit pin for semiconductor packages and related methods | Chee Hiong CHEW, Atapol Prajuckamol | 2017-02-14 |