| 9831266 |
Three-dimensional NAND device containing support pedestal structures for a buried source line and method of making the same |
James Kai, Johann Alsmeier, Yanli Zhang |
2017-11-28 |
| 9818759 |
Through-memory-level via structures for a three-dimensional memory device |
James Kai, Johann Alsmeier, Jixin Yu, Yoko Furihata, Hiroyuki Ogawa |
2017-11-14 |
| 9818693 |
Through-memory-level via structures for a three-dimensional memory device |
Fumiaki Toyama, Hiroyuki Ogawa, Yoko Furihata, James Kai, Yuki Mizutani +2 more |
2017-11-14 |
| 9799670 |
Three dimensional NAND device containing dielectric pillars for a buried source line and method of making thereof |
Masatoshi Nishikawa, Chun Ge, Yanli Zhang |
2017-10-24 |
| 9780112 |
Methods and apparatus for three-dimensional NAND non-volatile memory devices with side source line and mechanical support |
Chun Ge, Johann Alsmeier |
2017-10-03 |
| 9698153 |
Vertical NAND and method of making thereof using sequential stack etching and self-aligned landing pad |
Yanli Zhang, Murshed Chowdhury, Raghuveer S. Makala, Johann Alsmeier |
2017-07-04 |
| 9627403 |
Multilevel memory stack structure employing support pillar structures |
Tong Zhang, Jayavel Pachamuthu, Yao-Sheng Lee, Johann Alsmeier |
2017-04-18 |
| 9576975 |
Monolithic three-dimensional NAND strings and methods of fabrication thereof |
Yanli Zhang, James Kai, Raghuveer S. Makala, Murshed Chowdhury, Camilla Huang +1 more |
2017-02-21 |
| 9570463 |
Multilevel memory stack structure with joint electrode having a collar portion and methods for manufacturing the same |
Yanli Zhang, Raghuveer S. Makala, Murshed Chowdhury, Yao-Sheng Lee, Johann Alsmeier |
2017-02-14 |