Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9818693 | Through-memory-level via structures for a three-dimensional memory device | Fumiaki Toyama, Hiroyuki Ogawa, James Kai, Yuki Mizutani, Jixin Yu +2 more | 2017-11-14 |
| 9818759 | Through-memory-level via structures for a three-dimensional memory device | James Kai, Jin Liu, Johann Alsmeier, Jixin Yu, Hiroyuki Ogawa | 2017-11-14 |