Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9771258 | Wafer level MEMS package including dual seal ring | Buu Q. Diep, Adam M. Kennedy, Mark A. Lamb | 2017-09-26 |
| 9708181 | Hermetically sealed package having stress reducing layer | Adam M. Kennedy, Buu Q. Diep, Stephen H. Black, Tse E. Wong, Gregory D. Tracy | 2017-07-18 |