Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9708181 | Hermetically sealed package having stress reducing layer | Adam M. Kennedy, Buu Q. Diep, Stephen H. Black, Tse E. Wong, Thomas A. Kocian | 2017-07-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9708181 | Hermetically sealed package having stress reducing layer | Adam M. Kennedy, Buu Q. Diep, Stephen H. Black, Tse E. Wong, Thomas A. Kocian | 2017-07-18 |