Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9708181 | Hermetically sealed package having stress reducing layer | Adam M. Kennedy, Buu Q. Diep, Stephen H. Black, Thomas A. Kocian, Gregory D. Tracy | 2017-07-18 |
| 9706662 | Adaptive interposer and electronic apparatus | Kenneth T. Teshiba, Shea Chen | 2017-07-11 |
| 9648729 | Stress reduction interposer for ceramic no-lead surface mount electronic device | Shea Chen, Hoyoung C. Choe | 2017-05-09 |