Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9771258 | Wafer level MEMS package including dual seal ring | Buu Q. Diep, Thomas A. Kocian, Mark A. Lamb | 2017-09-26 |
| 9708181 | Hermetically sealed package having stress reducing layer | Buu Q. Diep, Stephen H. Black, Tse E. Wong, Thomas A. Kocian, Gregory D. Tracy | 2017-07-18 |
| 9570321 | Use of an external getter to reduce package pressure | Stephen H. Black | 2017-02-14 |